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Analysis of the reasons why the chip inductor is not tinned
May 19, 2018



Analysis of the reasons why the chip inductor is not tinned


Chip inductor.png

Why is the chip inductor not on the tin? What is the reason? Let the gain inductor be compiled for analysis and analysis.


Analysis of the reasons why the chip inductor is not tinned


There are two main reasons why the chip inductor is not tinned:


1. Solder paste flux is not enough. Add solder paste to the solder paste or shorten the constant temperature.

2. Reduce the pad inner distance and use the intermediate bridge type anti-tin bead pad opening.

After analyzing the reason why the chip inductor is not tinned, we have three solutions.

1. The area where the PCB pad is leaked outside is small, and the pad design is obviously problematic. The pad pitch can be adjusted, and the pad length can be lengthened.

2. Increase the thickness of the stencil and reaming, which can make up for the pad design problem.

3. All the problems appear on the edge of the PCB. It can be seen that the preheating on both sides of the component is very uneven. When the solder paste melts, the tension on both sides is unbalanced, causing the other end to tilt up, causing false soldering and less tin.


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