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How to reduce the influence of the heat generated by the inductor coil on the circuit
Feb 12, 2018


   How to reduce the influence of the heat generated by the inductor coil on the circuit

In the circuit design, the heat generated by the inductor is an important component of the circuit. The heat generated will cause the temperature of the inductor coil to rise. The temperature has a great influence on the inductor. The resistance of the coil generally increases with the increase of the temperature. How can we reduce the influence of the heat generated by the inductor on the coil? Below, please read the summary of this article for everyone.

    Reducing the influence of the heat conduction of the inductor coil on the circuit is as follows:

    First, each electronic component in each circuit has a thermal impedance, and the magnitude of the thermal impedance value can reflect the size of the heat transfer capacity between the medium or the medium. The size of the thermal impedance varies depending on the material, the external area, the intended use, and the mounting position. The use of thermal impedance electronic components with high thermal conductivity is the most traditional and effective way to reduce the heat conduction of the inductor coil.

    Second, for the use of circuit heat dissipation, the current market is the most widely used cooling fan to heat. By changing the hot air around the inductor coils and replacing the hot air with forced convection cold air, the circuit heat is continuously transferred to the surrounding air. In general, the cooling fan can effectively enhance 30% of the cooling capacity. The disadvantage is that it will produce vibration and noise. It is only applicable to conventional or modern devices such as computers, auto parts and equipment, inverters, hardware tools, and refrigeration equipment.

    Third, the heat-dissipating paint passes through direct construction to the surface of the object (inductor coil) to be cooled and cooled, while the heat accumulates and accumulates heat, while the heat absorbed will radiate heat to the outside space. It can also increase the self-cleaning, insulation, anti-corrosion, moisture resistance and other properties, is a new way to reduce the influence of the heat conduction of the inductor coil on the circuit.

    Fourth, the liquid thermal conductivity and the hot melt ratio of the gas is greater, so the use of liquid cooling will be better than the fan cooling effect. The heat is taken out of the circuit by direct and indirect contact of the cooling fluid with the heat generated by the inductor coil or other electronic components. The disadvantages are relatively high cost, large volume and weight, and difficult maintenance.

    Fifth, thermal paste adhesive and thermal paste its role is just like the literal meaning, with excellent thermal conductivity, can effectively improve the ability of electronic components in the circuit heat dissipation, often used to smear on the surface of electronic components (inductors), the heat Conducted to the heat sink (heat sink made of copper or aluminum), the heat sink after the heat absorption to the circuit outside, to maintain the normal temperature of the circuit. Secondly, the thermal paste has certain functions such as moisture-proof, dust-proof and anti-corrosion. It is an effective means to improve the heat-dissipation capability and stability of electronic components.

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