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SMT chip solder paste application precautions
Mar 30, 2017


           SMT chip solder paste application precautions

Solder paste operation methods and precautions:

                                              SMT INDUCTOR.jpg

1, solder paste storage


Solder paste should be stored at 5-10 degrees Celsius, with a shelf life of six months (from the date of production).

Before use, the solder paste is removed from the refrigerator at room temperature for at least 4 hours to restore the solder paste to the operating temperature to prevent moisture condensation on the solder paste surface, thereby reducing the generation of solder balls.

2, solder paste


In order to completely mix the solder paste, stir the solder paste thoroughly after warming up.

The mixing of the machine is generally 1-3 minutes, and the manual mixing is generally 3-6 minutes.

3, use the environment


Solder paste is best used in a temperature range of 20-25 degrees Celsius with a humidity of 35-65%.

4, printing


The use of solder paste printing precautions:

About 1/3 of the solder paste was added to the steel wire and the amount of solder paste on the steel wire was reduced by a small number of times to maintain the quality of the solder paste.

Solder paste that has not been used up the same day must not be placed together with unused solder paste. It should be placed in another container. After the solder paste is opened, it is recommended to use it within 24 hours at room temperature.

If the solder paste is not used up the same day, it is advisable to mix the unused paste with the new solder paste in a ratio of 1:2 and use it in small amounts several times each day.

After solder paste is printed on the substrate, reflow soldering is recommended within 6 hours.

To change the thread for more than one hour, please scrape the solder paste from the steel net into the solder paste can lid before changing the wire.

Avoid contact with the skin as much as possible. If exposed, wash with isopropyl alcohol.

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